[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - A novel wafer -level test method to measure the bond strength in microelectronic materials
Carniello, Sara, Siegert, Jorg, Loffler, Bernhard, Stuckler, EwaldYear:
2012
Language:
english
DOI:
10.1109/esime.2012.6191729
File:
PDF, 515 KB
english, 2012