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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Pre- and post-thinning silicon thickness mapping using a high throughput defect inspection system for advanced 3D IC packaging

Guittet, Pierre-Yves, Shivaprasad, D., Markwort, L., Savage, G., Kappel, C., Vartaman, V. H.
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Year:
2012
DOI:
10.1109/eptc.2012.6507155
File:
PDF, 1.07 MB
2012
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