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[IEEE 6th IEEE Workshop on Signal Propagation on Interconnects - Pisa (2002.5.12-2002.5.12)] Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects - Organic Chip Packaging Technology For High Speed Processor Applications
Garben, Bernd, Huber, Andreas, Kaller, Dierk, Klink, ErichYear:
2006
Language:
english
DOI:
10.1109/spi.2002.258316
File:
PDF, 418 KB
english, 2006