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[IEEE 2008 International Symposium on VLSI Technology, Systems, and Applications (VLSI-TSA) - Hsinchu, Taiwan (2008.04.21-2008.04.23)] 2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Reduction of layout variations with stress-compensated hybrid STI fills: a comprehensive analysis
Stadele, M., Ilicali, G., Landgraf, E., Goldbach, M., Finsterbusch, S., Lindolf, J., Radecker, J., Uhlig, B.Year:
2008
Language:
english
DOI:
10.1109/VTSA.2008.4530831
File:
PDF, 1.09 MB
english, 2008