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New Methodology for Combined Simulation of Delta-I Noise Interaction With Interconnect Noise for Wide, On-Chip Data-Buses Using Lossy Transmission-Line Power-Blocks
Deutsch, A., Smith, H.H., Rubin, B.J., Krauter, B.L., Kopcsay, G.V.Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2005.862647
Date:
February, 2006
File:
PDF, 1.63 MB
english, 2006