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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - A new commixing sample preparation technology for the interface analysis of second wire bonding with TEM
Liu, Xingjie, Pu, Haonan, Li, Yuesheng, Wang, JiajiYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6067006
File:
PDF, 1.17 MB
english, 2011