Surface Roughness Modeling for Silicon Direct Bonding

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 / 08 Vol. 1; Iss. 8

Surface Roughness Modeling for Silicon Direct Bonding

Liao, Guanglan, Lin, Xiaohui, Nie, Lei, Shi, Tielin
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Volume:
1
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2011.2155656
Date:
August, 2011
File:
PDF, 540 KB
english, 2011
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