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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Ultra-high density board technology for sub-100 ?m pitch nano-wafer level packaging
Sundaram, V., Fuhan Liu,, Aggarwal, A.O., Hosseini, S.M., Mekala, S., White, G.E., Tummala, R.R., Swaminathan, M., Woopoung Kim,, Madhavan, R., Lo, G., Iyer, M.K., Vaidyanathan, K., Ee Hua Wong,, RYear:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271502
File:
PDF, 337 KB
english, 2003