Clarification of Stress Field Measured by Multiwavelength...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 6 Vol. 4; Iss. 6

Clarification of Stress Field Measured by Multiwavelength Micro-Raman Spectroscopy in the Surrounding Silicon of Copper-Filled Through-Silicon Vias

Chan, Yuen Sing, Zhang, Xiaowu
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2319110
Date:
June, 2014
File:
PDF, 2.13 MB
english, 2014
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