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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Three dimensional air-gap structures for MEMS packaging
Saha, Rajarshi, Fritz, Nathan, Bidstrup-Allen, Sue Ann, Kohl, Paul A.Year:
2010
Language:
english
DOI:
10.1109/ECTC.2010.5490722
File:
PDF, 1.07 MB
english, 2010