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[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Effects of dielectric material and linewidth on thermal stresses of Cu line structures

Dongwen Gan,, Guotao Wang,, Ho, P.S.
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Year:
2002
Language:
english
DOI:
10.1109/iitc.2002.1014954
File:
PDF, 247 KB
english, 2002
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