Constitutive Modeling of Joint-Scale SAC305 Solder Shear...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 02 Vol. 3; Iss. 2

Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples

Herkommer, Dominik, Punch, Jeff, Reid, Michael
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2227481
Date:
February, 2013
File:
PDF, 1.38 MB
english, 2013
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