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[IEEE 1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC - San Francisco, CA, USA (8-10 Feb. 1996)] 1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC - 15 μm solder bonding of GaAs/AlGaAs MQW devices to MOSIS 0.8 μm CMOS for 1 Gb/s two-beam smart-pixel receiver/transmitter
Woodward, T.K., Krishnamoorthy, A.V., Goossen, K.W., Walker, J.A., Lentine, A.L., Novotny, R.A., D'Asaro, L.A., Chirovsky, L.M.F., Hui, S.P., Tseng, B., Kossives, D., Dahringer, D., Leibenguth, R.E.,Year:
1996
Language:
english
DOI:
10.1109/ISSCC.1996.488737
File:
PDF, 930 KB
english, 1996