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[IEEE APCCAS'96 - Asia Pacific Conference on Circuits and Systems - Seoul, South Korea (18-21 Nov. 1996)] Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems - Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices
Haksoo Han,, Hyunsoo Chung,, Sungkook Park,, Yungil Joe,, Sungsoo Park,, Gwanchong Joo,, Nam Hwang,, Hee Tae Lee,, Kang Seungoo,, Song Min-Kyu,Year:
1996
Language:
english
DOI:
10.1109/apcas.1996.569305
File:
PDF, 562 KB
english, 1996