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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Modeling and analysis of coplanar bonding wires for high-speed applications
Tschoban, Christian, Ndip, Ivan, Schmidt, Stefan, Guttowski, Stephan, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Reichl, HerbertYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642896
File:
PDF, 950 KB
english, 2010