[IEEE IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (14-16 July 2004)] IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) - Effect of chromium-gold and titanium-titanium nitride-platinum-gold metallization on wire/ribbon bondability
Jianbiao Pan,, Pafchek, R.M., Judd, F.F., Baxter, J.Year:
2004
Language:
english
DOI:
10.1109/iemt.2004.1321657
File:
PDF, 427 KB
english, 2004