![](/img/cover-not-exists.png)
[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Fluidic Interconnects in Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules
Yue, Tang Gong, Pin, Tan Siow, Khan, Navas, Pinjala, D., Lau, John H., Bin, Yu Ai, Vaidyanathan, Kripesh, Chuan, Toh KokYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763491
File:
PDF, 6.32 MB
english, 2008