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[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Copper-to-dielectric heterogeneous bonding for 3D integration
Wei Lin,, Juntao Li,, Washington, Joseph, Rath, David, Skordas, Spyridon, Kirihata, Toshiaki, Winstel, Kevin, Peethala, Brown, Demarest, James, Da Song,, Edelstein, Daniel, Iyer, SubramanianYear:
2014
Language:
english
DOI:
10.1109/ltb-3d.2014.6886145
File:
PDF, 452 KB
english, 2014