High Temperature Interconnect and Die Attach Technology:...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 06 Vol. 3; Iss. 6

High Temperature Interconnect and Die Attach Technology: Au–Sn SLID Bonding

Tollefsen, Torleif Andre, Larsson, Andreas, Lovvik, Ole Martin, Aasmundtveit, Knut E.
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2013.2253353
Date:
June, 2013
File:
PDF, 1.27 MB
english, 2013
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