[IEEE 6th International Conference on Solid-State and IC Technology - Shanghai, China (22-25 Oct. 2001)] 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) - Modeling and simulation of RLC interconnect effects with the AWE method
Zhu Zhaomin,, Streiter, R., Xiao Xia,, Ruan Gang,, Wolf, H., Otto, T., Gessner, T.Volume:
2
Year:
2001
Language:
english
DOI:
10.1109/ICSICT.2001.982033
File:
PDF, 251 KB
english, 2001