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[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Impacts of Cu contamination in 3D integration process on memory retention characteristics in thinned DRAM chip
Lee, Kangwook, Tanikawa, Seiya, Naganuma, Hideki, Bea, Jichel, Murugesan, Mariappine, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, MitsumasaYear:
2014
Language:
english
DOI:
10.1109/irps.2014.6860634
File:
PDF, 5.77 MB
english, 2014