A Robust Low-$k$/Cu Dual Damascene Interconnect (DDI) With...

IEEE Transactions on Device and Materials Reliability 2011 / 03 Vol. 11; Iss. 1

A Robust Low-$k$/Cu Dual Damascene Interconnect (DDI) With Sidewall Protection Layer (SPL)

Ueki, Makoto, Tada, Munehiro, Tagami, Masayoshi, Narihiro, Mitsuru, Ito, Fuminori, Hayashi, Yoshihiro
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Volume:
11
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2011.2106130
Date:
March, 2011
File:
PDF, 1.58 MB
english, 2011
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