![](/img/cover-not-exists.png)
Microstructure–property relationship in highly ductile Au–Cu thin films for flexible electronics
J. Lohmiller, N.C. Woo, R. SpolenakVolume:
527
Year:
2010
Language:
english
Pages:
10
DOI:
10.1016/j.msea.2010.08.043
File:
PDF, 1.62 MB
english, 2010