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A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys
Burke, Cillian, Punch, JeffVolume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2299400
Date:
March, 2014
File:
PDF, 8.67 MB
english, 2014