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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The influence of heat treatment on the adhesion between molding compound and lead frame
Wei Tan,, Xinyu Du,, Guangchao Xie,, Suqiong Qin,, Hujie Mei,, XingMing Cheng,Year:
2008
Language:
english
DOI:
10.1109/ICEPT.2008.4607075
File:
PDF, 216 KB
english, 2008