Thermal Conductivity Enhancement of Epoxy Composites by...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 / 10 Vol. 2; Iss. 10

Thermal Conductivity Enhancement of Epoxy Composites by Interfacial Covalent Bonding for Underfill and Thermal Interfacial Materials in Cu/Low-K Application

Liang, Qizhen, Moon, Kyoung-Sik, Jiang, Hongjin, Wong, Ching Ping
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Volume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2204885
Date:
October, 2012
File:
PDF, 2.18 MB
english, 2012
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