[IEEE 28th International Electronics Manufacturing Technology Symposium - San Jose, CA, USA (16-18 July 2003)] IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. - Study of non-solder, low cost and high performance flip chip QFN package using ultra thin Pd PPF
Se Chuel Park,, Chullae Cho,, Sung-Kwan Paek,Year:
2003
Language:
english
DOI:
10.1109/iemt.2003.1225874
File:
PDF, 628 KB
english, 2003