![](/img/cover-not-exists.png)
Interface between Sn–Sb–Cu solder and copper substrate
P. Šebo, P. Švec, D. Janičkovič, E. Illeková, Yu. PlevachukVolume:
528
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.msea.2011.04.008
File:
PDF, 851 KB
english, 2011