[IEEE Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394) - Singapore (1999.07.9-1999.07.9)] Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394) - New FIB-supported approaches for EELS-capable TEM-lamella preparation
Jacob, P., Schertel, A., Peto, L., Sundaram, G.Year:
1999
Language:
english
DOI:
10.1109/ipfa.1999.791307
File:
PDF, 389 KB
english, 1999