Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging
Ahmed Sharif, Y.C Chan, Rashed Adnan IslamVolume:
106
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.mseb.2003.09.003
File:
PDF, 391 KB
english, 2004