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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Power integrity simulation for multilayer power distribution networks based on GTLE and via model
Zhou, Yunyan, Wan, Lixi, Liu, Shuhua, Cao, Liqiang, Jia, JiaYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066895
File:
PDF, 1.31 MB
english, 2011