[IEEE 2002 8th International Advanced Packaging Materials Symposium - Stone Mountain, GA, USA (3-6 March 2002)] 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) - Effects of variations in design and process parameters on assembly process yield of area array solder interconnect packages
Chunho Kim,, Baldwin, D.F.Year:
2002
Language:
english
DOI:
10.1109/isapm.2002.990399
File:
PDF, 462 KB
english, 2002