[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Chip/package interactions on advanced flip-chip packages: Mechanical investigations on copper pillar bumping
Gallois-Garreignot, S., Fiori, V., Moutin, C., Tavernier, C.Year:
2012
Language:
english
DOI:
10.1109/estc.2012.6542106
File:
PDF, 1.99 MB
english, 2012