Leveler Effect and Oscillatory Behavior during Copper...

Journal of The Electrochemical Society 2012 / 08 Vol. 159; Iss. 9

Leveler Effect and Oscillatory Behavior during Copper Electroplating

Huang, Q., Baker-O'Neal, B. C., Parks, C., Hopstaken, M., Fluegel, A., Emnet, C., Arnold, M., Mayer, D.
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Volume:
159
Language:
english
Journal:
Journal of the Electrochemical Society
DOI:
10.1149/2.020209jes
Date:
August, 2012
File:
PDF, 902 KB
english, 2012
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