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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - The growth behavior of intermetallic compound layer at solder/Cu joint interface during soldering
Wu Fengshun,, Hu Yanxiang,, Wu Yiping,, An Bing,, Zhang Jinsong,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564659
File:
PDF, 717 KB
english, 2005