Physical Failure Analysis Deprocessing and Cross-Section...

IEEE Transactions on Device and Materials Reliability 2004 / 03 Vol. 4; Iss. 1

Physical Failure Analysis Deprocessing and Cross-Section Techniques for Cu/Low-k Technology

Wu, H., Hooghan, K., Cargo, J.
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2004.824358
Date:
March, 2004
File:
PDF, 534 KB
english, 2004
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