[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Development of a through-stack-via integrated SRAM module
Yunhui Zhu,, Xin Sun,, Shenglin Ma,, Qinghu Cui,, Xiao Zhong,, Yuan Bian,, Meng Chen,, Yongqiang Xiao,, Runiu Fang,, Zhenhua Liu,, Zhiyuan Zhu,, Xin Gong,, Jing Chen,, Min Miao,, WengaoYear:
2012
Language:
english
DOI:
10.1109/eptc.2012.6507105
File:
PDF, 1.25 MB
english, 2012