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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Temporary Bonding of Wafer to Carrier for 3D-Wafer Level Packaging
Shuangwu, Mark Huang, Pang, David Li Wai, Nathapong, Suthiwongsunthom, Marimuthu, PandiYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763468
File:
PDF, 7.18 MB
english, 2008