![](/img/cover-not-exists.png)
[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Effect of electromigration on the Cu-Ni cross-interaction in line-type Cu/Sn/Ni interconnect
Leida Chen,, Mingliang Huang,, Shaoming Zhou,, Song Ye,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582341
File:
PDF, 4.19 MB
english, 2010