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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - RF Property Variations on Plastic Packaging Due to Molding Compound Effects

Tseng, Kun-Fu, Hsion, Yi-Hsun, Lwo, Ben-Je, Yang, Min-I
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Year:
2006
Language:
english
DOI:
10.1109/emap.2006.4430565
File:
PDF, 2.00 MB
english, 2006
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