![](/img/cover-not-exists.png)
[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - RF Property Variations on Plastic Packaging Due to Molding Compound Effects
Tseng, Kun-Fu, Hsion, Yi-Hsun, Lwo, Ben-Je, Yang, Min-IYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430565
File:
PDF, 2.00 MB
english, 2006