[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Investigating the mechanical strength of Vapor Phase soldered chip components joints
Krammer, Oliver, Garami, TamasYear:
2010
Language:
english
DOI:
10.1109/siitme.2010.5653622
File:
PDF, 224 KB
english, 2010