A simulation study of IC layout effects on thermal...

IEEE Transactions on Components and Packaging Technologies 2000 / 6 Vol. 23; Iss. 2

A simulation study of IC layout effects on thermal management of die attached GaAs ICs

Reimer, C.J., Smy, T., Walkey, D.J., Beggs, B.C., Surridge, R.
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.846773
Date:
June, 2000
File:
PDF, 1.06 MB
english, 2000
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