[IEEE 2005 International Symposium on Electronics Materials...

  • Main
  • [IEEE 2005 International Symposium on...

[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Studies on Double-Layered Metal Bumps for Fine Pitch Flip Chip Applications

Ho-Young Son,, Yong-Woon Yeo,, Gi-Jo Jung,, Jun-Kyu Lee,, Joon-Young Choi,, Chang-Joon Park,, Min-Suk Suh,, Soon-Jin Cho,, Kyung-Wook Paik,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2005
Language:
english
DOI:
10.1109/emap.2005.1598242
File:
PDF, 3.41 MB
english, 2005
Conversion to is in progress
Conversion to is failed