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[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Studies on Double-Layered Metal Bumps for Fine Pitch Flip Chip Applications
Ho-Young Son,, Yong-Woon Yeo,, Gi-Jo Jung,, Jun-Kyu Lee,, Joon-Young Choi,, Chang-Joon Park,, Min-Suk Suh,, Soon-Jin Cho,, Kyung-Wook Paik,Year:
2005
Language:
english
DOI:
10.1109/emap.2005.1598242
File:
PDF, 3.41 MB
english, 2005