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[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Cu/Cu direct bonding by metal salt generation bonding technique with organic acid and its persistence of reformed layer
Koyama, Shinji, Hagiwara, Naoki, Shohji, IkuoYear:
2014
Language:
english
DOI:
10.1109/ltb-3d.2014.6886179
File:
PDF, 240 KB
english, 2014