![](/img/cover-not-exists.png)
[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - A quick-turn 3D structured ASIC platform for cost-sensitive applications
Teifel, John, Flores, Richard S., Jarecki, Robert, Bauer, Todd, Shinde, Subhash L.Year:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575634
File:
PDF, 1.68 MB
english, 2013