Validation and application of different experimental...

IEEE Transactions on Components and Packaging Technologies 1999 / 6 Vol. 22; Iss. 2

Validation and application of different experimental techniques to measure electronic component operating junction temperature

Lohan, J., Rodgers, P., Fager, C.M., Lehtiniemi, R., Eveloy, V., Tulikka, P., Rantala, J.
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.774740
Date:
June, 1999
File:
PDF, 361 KB
english, 1999
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