[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates
Francomacaro, A. S., Charles, H. K., Lehtonen, S. J., Keeney, A. C., Clatterbaugh, G. V., Banda, C. V.Year:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074071
File:
PDF, 2.26 MB
english, 2009