Reduced Gold-Plating on Copper Leads for Thermocompression...

IEEE Transactions on Parts Hybrids and Packaging 1977 / 09 Vol. 13; Iss. 3

Reduced Gold-Plating on Copper Leads for Thermocompression Bonding--Part II: Long Term Reliability

Panousis, N., Hall, P.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
13
Language:
english
Journal:
IEEE Transactions on Parts, Hybrids, and Packaging
DOI:
10.1109/tphp.1977.1135202
Date:
September, 1977
File:
PDF, 689 KB
english, 1977
Conversion to is in progress
Conversion to is failed