[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Copper wire bonding process in leaded packages with zero loss in quality, capacity, scrap & machine efficiency
Tan Chee Eng,Year:
2011
Language:
english
DOI:
10.1109/eptc.2011.6184438
File:
PDF, 1.15 MB
english, 2011