[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Development of copper-copper bonding by ultrasonic welding for IGBT modules

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.